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CMP and Back-Etch Process
Scheme of the CMP and Back Etch Process: (a) Junction area after RIE (b) Junction processed with CMP after the polishing procedure
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CMP and Back-Etch Process
Scheme of the CMP and Back Etch Process: (a) Junction area after RIE (b) Junction processed with CMP after the polishing procedure |
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Copyright © 2010 INESC MN; all rights reserved · Last update:27 October 2011 · |