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Magnetic noise characterization of commercial device
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Device design with the sensor at the bottom and low resistance leads tapering up to contact pads.
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View of a polished probe tip from the sensor side of the substrate The tip is limited to sizes less than 50 μm. Also, the substrate has been polished up into the edge of the sensor, with controllable removal of 0.25 μm of silicon at a time.
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Picture of a cantilever mount with a polished spin-valve sensor attached.
- Magnetic noise data for a polished spin valve probe.