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Infrastructure

INESC Microsystems and Nanotechnologies operates a 250 m2 cleanroom (class 100 and class 10 areas) and adjoining 250 m2 grey area (nominally class 10,000) for magnetic recording head and MR sensor fabrication, thin film semiconductor device and MEMS processing, biosensor and lab-on-chip fabrication including microfluidics.

 

Materials and Device Processing 

 

RAITH 150 Electron Beam Lithography system

Class 10 lithography area

Nordiko 3600 Ion Beam Deposition /Milling

 GeSim Nano-Plotter NP2.1

Class 100 cleanroom area

Disco Dicing Saw

The processing equipment include:

  • RAITH 150 electron beam lithograph (Financed by FCT Re-Equipment Program and installed October, 2006)
  • GeSiM Nano-Plotter NP2.1 (installed July 2009)
  • Heidelberg DWLii direct write laser lithography
  • magnetron sputtering system (5 systems)
  • ion-beam deposition/milling system (2)
  • plasma enhanced chemical vapor deposition systems (2)
  • reactive ion etching systems (2)
  • diffusion/passivation furnaces
  • dicing saw
  • automated lapping tool
  • spin coating and processing of soft lithographic techniques (SU8, PDMS) for microfluidics
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Device and Film Characterization

Device and film characterization equipment include:

  • Hitachi Scanning Electron microscope
  • Olympus optical microscope
  • Dektak profilometer
  • Rudolf ellipsometer
  • Vibrating Sample magnetometer
  • Magnetoresistance measurement setup
  • Optoelectronic characterizations
  • Optical detection of electromechanical deflection (in air and vacuum)
  • X-ray diffractometer
  • Fluorescence microscope
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Copyright 2012 INESC MN; all rights reserved Last update: 25 July 2013