Thin Film Microelectromechanical Systems (MEMS)

Introduction

The objective of this research is to develop MEMS (microelectromechanical systems) and NEMS (nanoelectromechanical systems) using: (i) thin-film silicon; (ii) all-polymer materials. Thin-film silicon MEMS, fabricated at temperatures below 250ºC, can yield high-quality resonators, can use large-area and flexible substrates, and are CMOS compatible. Polymer MEMS add to these characteristics the unique mechanical and chemical properties of the selected structural material.

This low-temperature thin-film silicon MEMS technology is currently being transferred by INESC-MN to Pixtronix, a US start-up company, for the development of low-power consumption portable display devices. 

For more information on this topic, contact João Pedro Conde or Virginia Chu

Main Results

1. Fabrication and demonstration of the first all-polymer microresonators.

2. Excitation and detection of MEMS electrostatic resonance in water.

3. Fabrication and characterization of the first microresonators on flexible polymeric substrates.

4. Fabrication of electrostatically actuated ultra-high Q flexural and torsional thin-film silicon paddle resonators.

5. Integration of thin-film silicon MEMS with magnetic field sensors (MagMEMS)

Current Research

1. Thin Film Bulk Resonators

2. Thin film Nanoelectromechanical structures (NEMS)

Projects and Collaborations 2004 - present

• “Microelectromechanical resonators: high sensitivity DNA detectors (BioMEMS)” (POCTI/CTM/37719/01). Partners: INESC-MN, BERG.

• IMTEK, Univ. Freiburg, Germany

• “Thin-film nanoelectromechanical systems for biological sensing applications (NEMS)” (PTDC/CTM/72772/2006).

Industrial Collaborations

• Development of amorphous silicon MEMS technology with a US-based display startup company.

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